(Preview) MCAD0641 Optical Phased Array Driver with 64 Independent Channels

Features #

  • Optical phased array driver with one dimensional beam steering of up to +/-75 degrees
  • Highly accurate beam steering angle
  • 2 degrees resolution of beam steering
  • 64 individually controllable phased array driving channels with up to 10 Vrms
  • Programmable overdrive feature for fast pixel voltage response time
  • Fastest Beam steering response time down to 200 µs
  • SPI communication interface with up to 40 MHz clock frequency
  • Independently enable and disable control of channels
  • 51mW max power consumption
  • Built-in self-test circuit
  • Full temperature range operation
  • Compatible with phased array pixel chip with different active areas (15mm x 12mm, 5mm x 5mm, etc)

Applications #

  • Industrial robots
  • Automotive LiDAR

General Description #

MCAD0641 is an optical phased array driver for liquid crystal metasurface. It generates up to 64-channels of programmable square wave signal to realize the beam steering, and each channel can be controlled independently and activated at the same time.

The output driver capability could be configured to obtain the best response time by providing up to 16 different selections.

A unique diagnose circuit is also embedded to check that the short-circuit conditions of the optical phased array, and then the user could disable the failed channel selectively.

The built-in over-drive function can fasten the response time of the optical phased array. The square wave generator can run up to 78.12kHz with 8 different setting.

The SPI interface provides the maximum applicable flexibility of MCAD0641, and the controlled phase data is transmitted through SPI communication.

Optical phased array driver

Pin Configuration and Functions #

optical phased array driver pin out
Figure 4-1: MCAD0641 Top View
Pin No. Pin nameSupply classPin typeDescription
0 ~ 63OUT [0] ~ OUT [63]HVDDAOSquare wave output channel
64COMHVDDAIOIO that can be configured for different case
65HGNDHGNDPWRHigh voltage supply ground pin, must be connected to other ground externally
66HVDDHVDDPWRHigh voltage supply pin
67DGNDDGNDPWRDigital supply ground pin, must be connected to other ground externally
68VDDVDDPWRDigital supply pin for digital core
69AGNDAGNDPWRAnalog supply ground pin, must be connected to other ground externally
70VDD_IOVDD_IOPWRSupply pin for input & output interface
71DATA_RDVDDDOData ready signal. Driver sends to MCU to indicate that the square wave signal is ready to send out. Only used for debug.
72SYNCVDDDISignal received from MCU to load the PWM data of 64 sets in register to output.
73CSVDDDIChip select of SPI
74DOUTVDDDOSerial Data Output of SPI, send out the data on the rising edge of SCLK
75DINVDDDISerial Data Input of SPI, sampled into the device on the falling edge of SCLK
76SCLKVDDDISerial Clock of SPI
77RSTVDDDIChip Reset
78REFHVDDAIReflection layer
79VDD_1P8VDD_1P8PWR1.8V LDO output, placed with 4.7uF ceremic cap.
80 ~ 87NCN/AN/AN/A
Table 4-1: MCAD0641 Pin Definition

Specifications #

Absolute Maximum Ratings #

ParameterMINMAXUNIT
Supply voltage (VDD)-0.36.0V
Supply voltage (HVDD)-0.315.0V
Supply voltage (VDD_IO)-0.36.0V
Decouple output voltage (VDD_1P8V)-0.36.0V
Logic input voltage (CS, SCLK, DIN, RST)-0.36.0V
Logic output voltage (SYNC, DOUT, DATA_RD)-0.36.0V
Driver output voltage (OUT [0] ~ OUT [63])-0.315V
COM-0.315V
REF-0.315V
Junction temperature range, TJ-40150̊C
Storage temperature-65150̊C

ESD Ratings #

VALUEUNIT
ESD (Electrostatic
discharge)
Human-body model, per ANSI/ESDA/JEDEC JS-001m, all pins+/-2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins+/-500V

Recommended Operating Conditions #

ItemsParametersMINNOMMAXUNIT
Supply voltage rangeVDD4.55.5V
HVDD51012V
VDD_IO1.65.5V
Operating free-air temperature, TA-402585°C

Electrical Characteristics #

VDD = VDD_IO = 3.3V, HVDD = 10V, TA = -40~85°C (unless otherwise noted)

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY CURRENT
IVDDVDD supply currentVVDD = 5V, fOSC = 40 MHz36mA
IVDD_IOVDD_IO supply currentVVDD_IO = 3.3V36mA
IHVDDHVDD supply currentVHVDD = 10V, Fsw = 40 kHz510mA
SUPPLY VOLTAGE
VVDDVDD supply voltage range4.55.5V
VVDD_IOVDD_IO supply voltage range1.65.5V
VHVDDHVDD supply voltage range4.51014.5V
DIGITAL INPUTS/OUTPUTS (DIN, DOUT, SCLK, CS, SYNC)
VOLLow-level output voltageIOH = 4mA,
VVDD_IO = 3.3V
GND + 0.25V
VOHHigh-level output voltageIOH = -4mA, VVDD_IO = 3.3VVDD_IO – 0.6V
VIHHigh-level input voltageVVDD_IO = 3.3V2.1V
VILLow-level input voltageVVDD_IO = 3.3V1.1V
IOH4mA
IOL-4mA
SQUARE WAVE DRIVER (OUT [0] ~ OUT [63])
IDOH_OUTOutput source currentProgrammable in register DRV_OUT_SET [2:0] = 3b00120mA
IDOL_OUTOutput sink currentProgrammable in register DRV_OUT_SET [2:0] = 3b00120mA
tjitterPeriod jitter, determined by system clock40ns
COUT_ParaOUT parasitic capacitance when output config to be Hi-Z mode0.5pF
COM, REF DRIVER
IDOH_LYRCOM/REF driver source currentProgrammable in register DRV_LYR_SET [2:0] = 3b00120mA
IDOL_LYRCOM/REF driver sink currentProgrammable in register DRV_LYR_SET [2:0] = 3b00120mA
CLYR_ParaParasitic capacitance when output config to be Hi-Z mode30pF
RESET THRESHOLD
VRST_HIReset input high threshold1.2V
VRST_LIReset input low threshold0.4V
SYSTEM PERFORMANCE
VHVDD_UVLO_FHVDD falling to trigger HVDD undervoltage lockoutRegister programmable to be disabled, with 3% accuracy4.2
VHVDD_UVLO_RHVDD rising to exist HVDD undervoltage lockoutRegister programmable to be disabled, with 3% accuracy5V
VHVDD_OVLO_RHVDD rising to trigger HVDD overvoltage lockoutRegister programmable to be disabled, with 3% accuracy15.5V
VHVDD_OVLO_FHVDD falling to exist HVDD overvoltage lockoutRegister programmable to be disabled, with 3% accuracy15V
fCLKSquare wave driver clock frequencyAdd external OSC as option384042MHz
Vshort_thShort detection threshold in self-test3.5V
tpDriver propagation delay from SYNC active to 10% x HVDD, including 64 channels and COM1.25µs
tmismatchDriver delay mismatch, including 64 channels and COM40ns
tsyncMinimum time of SYNC active0.51µs
tdata_readyData Ready pulse width4µs

Switching Characteristics #

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SQUARE WAVE DRIVER (OUT [0] ~ OUT [63])
trDriver rising time, 10% rises to 90%Cload = 2.6nF, VHVDD = 5~12V1.25µs
tfDriver falling timeCload = 2.6nF, VHVDD = 5~12V1.25µs
SQUARE WAVE DRIVER (COM)
trDriver rising timeCload = 10nF, VHVDD = 5~12V1.25µs
tfDriver falling timeCload = 10nF, VHVDD = 5~12V1.25µs
SPI INTERFACE
fSPISCLK frenquency40MHz
tCSSCCS low to first SCLK, setup time10ns
tSPWHSCLK pulse high level width11ns
tSPWLSCLK pulse low level width11ns
tDISTSetup time, DIN valid to SCLK falling edge5ns
tDIHDHoldup time, valid DIN after SCLK falling edge5ns
tDOPDSCLK rising edge to DOUT valid9ns
tCSCS high pulse20ns
tCSDODCS low to DOUT driven10ns
tSCCSEighth SCLK falling edge to CS high10ns
tSDECODECommand decode time4ns
tCSDOZCS high to DOUT Hi-Z20ns
Figure 5-1: SPI timing specification

Detailed Description #

Overview #

MCAD0641 is an optical phased array driver. It generates up to 64-channels of programmable square wave signal to realize the beam steering, with 8-bit resolution.

For each output channel, MCAD0641 allows controlled independently and activated at the same time, and it uses 2 groups of registers to store the phase information of square wave output for overdrive mode and normal mode. All the outputs can be enabled or disabled individually by configuring the register bit. The output driver capability could be configured to obtain the best response time by providing up to 16 different selections.

MCAD0641 provides two outputs to control the top glass (COM) and reflection layer (REF) of the optical phased array. The COM and REF is allowed to be configured to be square wave, HVDD and HGND.

A unique diagnose circuit is also embedded to check that the short-circuit conditions of the optical phased array. 3 kinds of diagnose are provided the loop between channel to channel, the loop between channel to COM, and the loop between channel to REF. The test results are record in corresponding registers, and then the user could read and disable the failed channel selectively.

The built-in over-drive function can fasten the response time of the optical phased array. The square wave generator can run up to 78.12kHz with 8 different setting.

MCAD0641 is programmed through a standard SPI interface. The communication interface allows sequence read and write instructions. For typical application, the SPI master transfers 3 operation bytes and 128 data bytes to MCAD0641 slave in sequence to update the output related registers.

Functional Block Diagram #

Figure 6-1: MCAD0641 block diagram

Feature Description #

Power-Up / Down #

Three power supply rails should be provided for MCAD0641 for normal operation.

The VDD power is the external power supply, and it generates the AVDD power supply for the analog block and the VDD_1P8 is the power supply for the digital circuit through the internal 1.8V LDO. When VDD powers on, the chip will be POR.

HVDD is the external power supply as the power rail of the 64+1 channels PWM output. VDD_IO is the external power supply as the power rail of input and output interface.

Whatever any power supply power sequence, MCAD0641 could be powered on normally and stay in STANDBY state.

Data-in process for each subframe #

There are two WCLR registers located at the end of the data register block and the end of overdrive data register block. When OVERDRIVE_EN is high, DATA_RD is set high when Data_Ready_Flag is low and OD_Data_Ready_Flag reaches low. When OVERDRIVE_EN is low, DATA_RD is set high when Data_Ready_Flag reaches low.

After DATA_RD is set high, both Data_Ready_Flag and OD_Data_Ready_Flag are set to high.

Figure 6-2: Data-in flow chart for each subframe
Hardware reset #

In some unexpected application scenarios, MCAD0641 enters deadlock state accidentally. If the power supply of MCAD0641 can’t be cut off by software, then the deadlock state can’t exist in a packaged module.

To avoid this application scenario happening, the hardware reset function is integrated in MCAD0641 through RESET pin. Normally, RESET pin is pull-up to VDD with 100K internal resistor.

When there is a low level on the RESET pin longer than 0.5us, the whole chip will be reset. The reset function is same as the POR. The chip returns to the initial state as POR. Also, all the registers are reset.

COM and REF pin #

COM and REF are two identical drivers. It can be biased to either HVDD or HGND. Also, it can be configured to be square wave output mode or Hi-Z mode.

Self-test #

Some short or open conditions may happen during manufacturing or application. It should report the short or open status through the register, then the master MCU can read the status and decide next operation.

During the application, if all these three bits is set 1 at the same time, the priority is as below:

  1. Channel – Channel short loop test
  2. Channel – COM short loop test
  3. Channel – Reflection short loop test
Channel – Channel short loop test #

There is potential risk that some of the OP1 channels (OUT [0:63]) are shorted to each other, so a self-test function is needed to find out the shorted channel and disable the corresponding driver output channel.

Here we assume only the adjacent channels could be shorted. We propose a solution to find out the shorted pair:

Switch on CH_X and CH_X+1

  1. Bias CH_X with 1mA current source from HVDD
  2. Bias CH_X+1/-1 to HGND through 5mA (for example) current sink
  3. Compare VCH_X with Vshort_th, no short happens if VCH is lower than 0.5V. Otherwise, it is

considered that short happening.

4. Record the status in the corresponding register.
Repeat it till all channels are tested. The shorted channels are recorded.

Channel – COM short loop test #

IC should figure out if there is a short condition between Channels and COM. Similar detection method as Channel-Channel:

  1. Switch on COM and CH_X
  2. Bias CH_X with 1mA current source from HVDD
  3. Bias COM to HGND through 5mA (for example) current sink
  4. Compare VCH_X with Vshort_th, no short happens if VCH is lower than 0.5V. Otherwise, it is considered that short happening.

Repeat it till all channels are tested. The shorted channels are recorded.

Channel – Reflection layer short loop test #

IC should figure out if there is a short condition between channels and reflection layer.

Similar detection method as Channel-Channel:

  1. Switch on CH_X and reflection layer
  2. Bias CH_X with 1mA current source from HVDD
  3. Bias reflection layer to HGND through 5mA (for example) current sink
  4. Compare VCH_X with Vshort_th, no short happens if VCH_X is lower than 0.5V. Otherwise, it is

considered that short happening.

Repeat it till all channels are tested. The shorted channels are recorded.

Square wave generator #

The chips generate 64+1 square wave signals. There are 64 independent control lines and 1 COM line. All the square waves have the same frequency but different phase delays. The phase delay of COM line is always 0 degree.

The square wave frequency can be configured based on the CLKSEL register, and it can be set as 0.61kHz, 1.22kHz, 2.44kHz, 4.88kHz, 9.77kHz, 19.53kHz, 39.06Hz, 78.12kHz.

The phase delay has 8-bit resolution to achieve 0–180-degree phase shift range. But in the application, only 180-degree range is needed.

Beam-steering timing #
Figure 6-3: Beam-Steering timing

Make sure data for new subframes are loaded to OVERDRIVE/PRESENT registers before sending out SYNC signal from master.

The values in PWM_OUTx are updated when SYNC signal changes from high to low. The PWM generator is reset at this point.

Data_RD is given when specific WCLR registers are written. It is used to indicate completion of data transmission to data registers and overdrive data registers. This signal is not in the main data process loop. It can be ignored. The refreshments of OUTx are controlled by SYNC only.

Over-drive mode #

Due to the relationship between “applied voltage and response time” “applied voltage vs phase change” for optical phased array, if the phase change is small, the applied voltage should be small, and the response time will be long. To reduce the response time, a higher voltage can be inserted before the target voltage. This technique is called over-drive.

The figure below shows optical phased array response time compensation feature integrated in MCAD0641. GL is gray level, means to the applied voltage. This illustrates how the “substituted boost GL” (which is the over-drive voltage) reduces the response time.

Figure 6-4: Over-drive operation theory

In MCAD0641, the over-drive function is available when the user sets the register bit OD_EN=1. Also, the optional register is used to select the optimal over-drive cycles that the over-drive data lasts to obtain the best system performance.

Device Functional States #

Digital control and sequencer logic:

Figure 6-5: Operation modes
Warmup #

In Warmup state, default register values are loaded. The data interface is not responsive in this

state. After the warmup state is completed, MCAD0641 stays in standby state.

Standby #

In STANDBY state all level shifter output stages are in a HiZ state. The device remains in STANDBY state if all enable registers (SCAN_EN, SHORT_CH_CH_TEST_EN, SHORT_CH_COM_TEST_EN, SHORT_CH_REF_TEST_EN) remains zero. All functions can be configured by data interface at this time. The master MCU shall read the test results and the channel status to check the functionality of MCAD0641 before proceeding to the next state.

Short Test State #

When MCAD0641 receives short test command, it will initial a short test internally to check the status of the backward stage. Also, if not necessary in the application, the user can’t initial this test without the short test command.

During the short test mode, MCAD0641 finishes the channel-channel short test, channel-com short test, or channel-ref short test depending on the command of the master MCU.

After the short test is finished, MCAD0641 updates the status of the short status in the register and then goes back to standby mode. Also, the corresponding register bit is reset to 0 automatically.

Scan State #

When MCAD0641 enters scan state by the user’s command through SPI, it will send out the PWM signal based on the PWM data register. Every time SYNC goes to high, MCAD0641 will refresh the PWM information.

If the register bit OVERDRIVE_EN is set high, MCAD0641 will perform the overdrive data on the 64 output channels first, then switches to the PWM information based on the PWM data register.

Programming #

SPI Interface #

The external microprocessor (master) communicates with the MCAD0641 chip via the SPI interface. The master sets application-specific chip configurations, triggers the measurements and reads the data. The SPI lines need to be connected according to the application diagram introduction.

Data Transfer Formats #

The SPI-compatible serial interface consists of four signals: CS, SCLK, DIN and DOUT. The interface reads and writes registers, thus different commands to MCAD0641. There are two commands supported, RREG and WREG, which stand for reading registers and writing registers, separately. They are both multi-byte commands and the SPI transfer must follow a strict format in order to succeed.

Figure 6-6: SPI Data transfer formats
Figure 6-7: WREG command format
Figure 6-8: RREG command format
Command Summary #

For the application user, only READ and WRITE commands are available.

Also, the designer could enter backdoor or test mode if some unique commands are received. In backdoor mode, hidden registers can be read or written, not open to user applications.
In test mode, some tests are available in ATE or bench tests.

CommandFirst CODEDescription
READ0xAAReads command
WRITE0x55Writes command
Backdoor0x5AWhen receiving the first byte data 0x5A, it should be followed by 0xA5, 0x6F, 0xF6 to enter backdoor mode. Exit backdoor mode by setting CS high.
Test-Mode0x6FWhen receiving the first byte data 0xA5, it should be followed by 0xF6, 0x5A, 0xA5 to enter test mode.
Exit backdoor mode by setting CS high.
Table 6-1: SPI command head summary
Serial Clock #

SCLK is the SPI serial clock. SCLK is used to shift commands in shift data out from the device. The serial clock features a Schmitt-triggered input and clock data on the DIN and DOUT pins into and out of the MCAD0641. Even though the input has hysteresis, it is recommended to keep SCLK as clean as possible to prevent glitches from accidentally forcing a clock event.

When shifting in commands with SCLK, make sure that the entire set of SCLKs is issued to the device, as required by the command format. The timing between SCLK pulses can be loose, but the transfer will strictly follow the command format. If the interface goes to an unknown state, take RESET low to reset the transfer state and the internal registers.

Data Input (DIN) #

The data input pin (DIN) is used along with SCLK to communicate with MCAD0641 (opcode

commands and register data). The device latches data on DIN on the SCLK falling edge.

Data Output (DOU) #

The data output pin (DOUT) is used with SCLK to read register data from the MCAD0641. Data on DOUT is shifted out on the SCLK rising edge. DOUT stays in a high-impedance state when CS is high.

Clock Select #

Figure 6-9: Output PWM frequency generation

The device includes a 40MHz internal oscillator. Additional clocking options include the internal oscillator divided by 1 – 128. The system clock source is selected using the CLKSEL register.

For those applications that are not time-limited, the PWM frequency at 1kHz is recommended.

CLCSELClock Freq (MHz)Square Wave Freq (kHz)Minimum Response Time (µs)
0004078.1251.2
0012039.0625.6
0101019.5351.2
01159.77102.4
1002.54.88204.8
1011.252.44409.6
1100.6251.22819.2
1110.31250.61409.6
Table 6-2: PWM clock Selection

Register Map #

Please see attached document for details.

Application and Information #

Application Information #

Figure 7-1: MCAD0641 application diagram

Power Supply and Layout Recommendations #

Designers must pay close attention to PCB layout to achieve optimum performance for the

MCAD0641. Some key guidelines are as below:

  • Component placement:
    • Low-ESR and low-ESL capacitors must be connected close to the device between the VDD and AGND pins, and between the HVDD and HGND pins to bypass noise and to support transient currents when drive the external optical phase array.
    • To ensure the stable power supply for the digital circuit, the minimum 4.7uF ceramic capacitor should be located at VDD_1P8 pin.
    • The minimum 4.7uF is necessary at HVDD pin for the 64 channels output.
  • SPI communication considerations:
    • To obtain better timing sequence delay, the routing of the DIN, SCLK, DOUT and CS should be parallel together.
    • To avoid mis-trigger of the SPI communication by the switching node coupling, it is suggested to SPI communication line not close or overlap with the PWM network.
  • Thermal considerations:
    • A large amount of power may be dissipated by the MCAD0641 if the driving voltage is high, the load is heavy, or the switching frequency is high. Proper PCB layout can help dissipate heat from the device to the PCB and minimize junction-to-board thermal impedance (θJB).
    • Increasing the PCB copper connecting to the HVDD and HGND pins is recommended, with priority on maximizing the connection to HGND.

Mechanical and Packaging Information #

Orderable Information #

Orderable DeviceStatusPackage TypePinsMSLOperation Temp (°C)Device Marking
MCAD0641DevelopingQFN 10 x 1088Level-3-40 to 125MCAD0641

Related Documents #

(Preview) MCAE102-940 Metasurface Beam Steerer with 64 Independent Channels

(Preview) MMAE068-940 3D Time-of-Flight Camera with Meta Beam Steerer

Integrated Meta Optics

Updated on November 15, 2024
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